Description
This specification covers the engineering requirements for electrodeposition of gold and the properties of the deposit.This plating has been used typically to improve the solderability, electrical conductivity, corrosion resistance, performance, and appearance of electronic and electrical parts, but usage is not limited to such applications.
Product Details
- Published:
- 07/18/2002
- File Size:
- 1 file , 96 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
