Description
Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.
Product Details
- Edition:
- 1.0
- Published:
- 03/14/2003
- Number of Pages:
- 127
- File Size:
- 1 file , 5.8 MB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
