Description
IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.
Product Details
- Edition:
- 3.0
- Published:
- 07/14/2020
- Number of Pages:
- 17
- File Size:
- 1 file , 1000 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
