Description
IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).
Product Details
- Edition:
- 1.0
- Published:
- 12/11/2001
- Number of Pages:
- 21
- File Size:
- 1 file , 250 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
